Tele/Datacom(112Gbps Application)
Product application
Tele/Datacom(112Gbps Application)
Tele/Datacom(112Gbps Application)
Layer Count: 18L
Material: Tachyon-100G
Board Thk: 2.6mm
Array Size: 164 mm x 244 mm
Min Line Width/Spacing: 112um/114um
Min Drill Bit size: 0.2mm
Aspect Ratio: 12:1
Surface Treatment: OSP
N+N Structure, POFV
Add：
Founder PCB Industrial Base
Fushan Industry Zone, Doumen District, Zhuhai, Guangdong,China 519175
Tel：+86 756 5658614
